# tee_tee_dev_kit

**Repository Path**: openharmony-sig/tee_tee_dev_kit

## Basic Information

- **Project Name**: tee_tee_dev_kit
- **Description**: No description available
- **Primary Language**: Unknown
- **License**: MulanPSL-2.0
- **Default Branch**: master
- **Homepage**: None
- **GVP Project**: No

## Statistics

- **Stars**: 8
- **Forks**: 20
- **Created**: 2022-02-17
- **Last Updated**: 2025-05-07

## Categories & Tags

**Categories**: Uncategorized

**Tags**: None

## README

# 🚨 **重要提示 | IMPORTANT**
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> **⚠️ 此代码仓已归档。新地址请访问 [tee_tee_dev_kit](https://gitcode.com/openharmony-sig/tee_tee_dev_kit)。| ⚠️ This repository has been archived. For the new address, please visit [tee_tee_dev_kit](https://gitcode.com/openharmony-sig/tee_tee_dev_kit).**
>
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# tee_dev_kit module introduction<a name="EN-US_TOPIC_0000001078530726"></a>

-   [Introduction](#section469617221261)
-   [tee_dev_kit engineering framework](#section15884114210197)

## Introduction<a name="section469617221261"></a>

The tee_dev_kit component provides SDK capabilities. The SDK capabilities include: TA compilation dependent scripts, header files, TA's ability to issue certificates and sign perm_config signatures, and sec file signatures.

## tee_dev_kit engineering framework<a name="section15884114210197"></a>

-   README.md：English guidance document.
-   README_zh.md：Chinese guidance document.
-   sdk：The sdk package capabilities in tee os, the detailed sdk capabilities are introduced in the README.md and README_zh.md files in the sdk directory.
-   bundle.json: tee_dev_kit component description file.