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README
Apache-2.0

device_soc_telink

简介

本仓库为泰凌微电子(Telink Semi)公司的TLSR9系列芯片相关代码仓库,用于存放与SoC芯片相关的SDK及适配代码。 使用同一系列SoC,开发不同的device或board时,可共用该仓库代码进行开发。

开发环境

推荐采用Windows+Ubuntu环境进行开发:

  • Windows环境用于编写代码、下载程序和烧入固件等,系统要求:Windows 10 64位系统。

  • Linux环境用于代码下载、编译工程和生成固件等,系统要求:Ubuntu 20.04 64位及以上版本。

    • 若不确定所使用的Linux设备的系统及版本,请在bash中运行如下命令查看:
    lsb_release -a
    • 请在确认Linux系统不低于Ubuntu 20.04.XX LTS的情况下执行后续的步骤;否则,请升级或更换合适的Liunx设备。

若需要支持在Linux与Windows之间的文件共享以及编辑,请在Linux设备上适当地安装和配置samba、vim等常用软件。

安装工具

本仓库包含的编译构建脚本和打包镜像工具等,需要在Linux环境上执行。

本章节参考了OpenHarmony文档《搭建轻量与小型系统》,请点击查看详情

安装repo

码云repo是一种代码版本管理工具,可以用来打包获取OpenHarmony的源码。

  1. 在home文件夹下创建repo安装目录:

    mkdir ~/bin
  2. 下载repo至安装目录:

    wget https://storage.googleapis.com/git-repo-downloads/repo -P ~/bin/
  3. 改变执行权限:

    chmod a+x ~/bin/repo
  4. 在~/.bashrc文件的末尾,额外加入以下内容,配置环境变量:

    # set environment for repo
    export PATH=~/bin:$PATH
    export REPO_URL=https://mirrors.tuna.tsinghua.edu.cn/git/git-repo/
  5. 重启bash或执行以下命令让环境变量生效:

    source ~/.bashrc

安装常用库和工具

使用如下apt-get命令安装后续操作所需的库和工具,用于编译C/C++代码:

sudo apt-get install build-essential gcc g++ make zlib* libffi-dev e2fsprogs pkg-config flex bison perl bc openssl libssl-dev libelf-dev libc6-dev-amd64 binutils binutils-dev libdwarf-dev u-boot-tools mtd-utils gcc-arm-linux-gnueabi

安装Python3

本项目要求安装Python 3.8及以上版本,本文档以Python 3.8为例。

  1. 在bash中输入下列命令,查看python版本:

    python3 --version

    如果不低于3.8,可以忽略第二步的重新安装,从第三步的设置开始。

  2. 如果Python版本低于3.8,不建议直接升级,请按照如下步骤重新安装。

    sudo apt-get install python3.8
  3. 设置python和python3软链接为python3.8。

    查看python3.8的位置:

    which python3.8

    将python和python3切换为python3.8:

    sudo update-alternatives --install /usr/bin/python python /usr/bin/python3.8 1  
    # /usr/bin/python3.8 为上一步查看的python3.8的位置
    sudo update-alternatives --install /usr/bin/python3 python3 /usr/bin/python3.8 1 
    # /usr/bin/python3.8 为上一步查看的python3.8的位置
  4. 安装并升级Python包管理工具(pip3),任选如下一种方式。

    • 命令行方式:

      sudo apt-get install python3-setuptools python3-pip -y
      sudo pip3 install --upgrade pip
    • 安装包方式:

      curl https://bootstrap.pypa.io/get-pip.py -o get-pip.py
      python get-pip.py

安装ohos-build

在安装ohos-build之前,请确保已安装Python 3.8及以上版本;否则,请安装Python3

  1. 在bash中运行如下命令安装ohos-build:

    python3 -m pip install --user ohos-build
  2. 执行"hb -h",有打印以下信息即表示安装成功:

     usage: hb [-h] [-v] {build,set,env,clean} ...
    
     OHOS Build System version 0.4.6
    
     positional arguments:
     {build,set,env,clean}
         build               Build source code
         set                 OHOS build settings
         env                 Show OHOS build env
         clean               Clean output
    
     optional arguments:
     -h, --help            show this help message and exit
     -v, --version         show program's version number and exit

安装Telink的编译工具链

目前,社区中的RISCV32交叉编译工具链还未适配,可能会出现兼容性问题。 因此,推荐使用来自Telink官方网站的Telink RISC-V Linux Toolchain。

  1. 下载工具链

    可以点击下载该编译链工具,并解压到用户自行指定的位置。 或者,也可以使用下列命令下载并解压。

    wget http://wiki.telink-semi.cn/tools_and_sdk/Tools/IDE/telink_riscv_linux_toolchain.zip
    unzip telink_riscv_linux_toolchain.zip
  2. 设置依赖项:

    sudo dpkg --add-architecture i386
    sudo apt-get update
    sudo apt-get install -y libc6:i386 libncurses5:i386 libstdc++6:i386
  3. 在~/.bashrc文件的末尾,根据该toolchain解压后所存放的路径,加入环境变量:

    # set environment path for TELINK toolchain
    RISCV=telink_riscv_linux_toolchain/nds32le-elf-mculib-v5f
    export PATH=~/$RISCV/bin:$PATH
  4. 保存后,重启bash或执行以下命令使环境变量生效:

    source ~/.bashrc

获取源码

在Linux环境下通过以下步骤获取OpenHarmony源码。

本章节参考了OpenHarmoney文档《搭建轻量与小型系统》,请点击详情查看详情

  1. 新建代码存放目录(用户可以自行指定为其他目录),如openharmony,并进入该目录:

    mkdir ~/openharmony
    cd ~/openharmony
  2. Repo初始化,指定码云上面OpenHarmony的manifest仓库中所包含的git仓库:

    repo init -u https://gitee.com/openharmony/manifest --no-repo-verify
  3. 仓库初次同步,下载码云上所需的git仓库的代码。

    repo sync -c

    这里下载的过程的耗时可能会很长,请耐心等待。

  4. 下载好代码后,下载大容量二进制文件。

    repo forall -c 'git lfs pull'

确认目录结构

在Linux环境下的源码的根目录下,可以查看SoC目录以及其他与Telink相关文件的目录结构。

SoC目录

在device文件夹下,确保device/soc目录结构如下(截至2022年6月1日):

user:~/openharmony/device/soc$ tree -L 3
.
└── telink
    ├── b91                                     # b91 SoC适配目录
    │   ├── adapter                                 # 外设驱动、BLE、文件系统适配
    │   ├── b91m_ble_sdk                            # liteos b91 SDK适配
    │   ├── BUILD.gn                                # GN构建脚本
    │   ├── hcs                                     # 设备描述文件
    │   ├── hdf                                     # HDF设备驱动框架目录
    │   ├── Kconfig.liteos_m.defconfig.b91          # b91 Kconfig默认配置
    │   ├── Kconfig.liteos_m.defconfig.series       # series Kconfig默认配置
    │   ├── Kconfig.liteos_m.series                 # series Kconfig配置项
    │   ├── Kconfig.liteos_m.soc                    # SoC Kconfig配置项
    │   ├── liteos.ld                               # 链接脚本
    │   └── liteos_m                                # liteos_m 各模块实现
    ├── BUILD.gn                                # GN构建脚本
    ├── End User License Agreement.md               # 终端用户证书协议
    ├── figures                                      # README插图文件夹  
    .   ├── ...                                     # 插图
    │   └── ...                                     # 插图
    ├── Kconfig.liteos_m.defconfig              # liteos_m Kconfig默认配置
    ├── Kconfig.liteos_m.series                 # liteos_m series配置项
    ├── Kconfig.liteos_m.soc                    # liteos_m SoC配置项
    ├── LICENSE                                     # 证书文件
    ├── OAT.xml                                     # 开源仓审查规则配置文件
    ├── README.md                                   # 英文版README
    ├── README_zh.md                                # 中文版README
    └── util                                    # 工具项目录
        └── util.gni                                #  固件生成脚本

Board目录

在device文件夹下,确保device/board目录结构如下(截至2022年6月1日):

user:~/openharmony/device/board$ tree -L 3
.
└── telink
    ├── b91_devkit                              # B91 Generic Starter Kit开发板配置目录
    │   ├── b91_devkit_defconfig                    # B91 Generic Starter Kit Kconfig默认配置
    │   ├── BUILD.gn                                # GN构建脚本
    │   ├── Kconfig.liteos_m.board                  # Board liteos_m Kconfig配置项
    │   ├── Kconfig.liteos_m.defconfig.board        # Board liteos_m Kconfig默认配置
    │   └── liteos_m                                # 构建脚本目录
    ├── BUILD.gn                                # GN构建脚本
    ├── drivers                                 # 板级驱动存放目录
    │   └── BUILD.gn                                # GN构建脚本
    ├── hcs                                     # hcs硬件描述配置目录
    │   ├── b91_devkit.hcs                          # B91 Generic Starter Kit hcs硬件描述脚本
    │   └── BUILD.gn                                # GN构建脚本
    ├── figures                                   # README插图文件夹  
    .   ├── ...                                     # 插图
    │   └── ...                                     # 插图
    ├── Kconfig.liteos_m.boards                 # Board liteos_m Kconfig配置项
    ├── Kconfig.liteos_m.defconfig.boards       # Board liteos_m Kconfig默认配置
    ├── LICENSE                                 # 证书文件
    ├── OAT.xml                                 # 开源仓审查规则配置文件
    ├── README.md                               # 英文版README
    └── README_zh.md                            # 中文版README

Vendor目录

在vendor文件夹下,确保vendor文件夹目录结构如下(截至2022年6月1日):

user:~/openharmony/vendor$ tree -L 3
.
└── telink
    ├── ble_demo                                # BLE应用示例工程
    │   ├── b91_gatt_sample                         # BLE示例代码
    │   ├── BUILD.gn                                # GN构建脚本
    │   ├── config.json                             # 子系统裁配置裁剪脚本
    │   ├── hals                                    # 产品参数配置
    │   ├── hdf_config                              # HDF硬件描述配置
    │   ├── kernel_configs                          # Kconfig配置输出
    │   └── ohos.build                              # 子系统模块单
    ├── led_demo                                # LED测试示例工程
    │   ├── BUILD.gn                                # GN构建脚本
    │   ├── config.json                             # 子系统裁配置裁剪脚本
    │   ├── hals                                    # 产品参数配置
    │   ├── hdf_config                              # HDF硬件描述配置
    │   ├── kernel_configs                          # Kconfig配置输出
    │   ├── led_demo                                # LED示例代码
    │   └── ohos.build                              # 子系统模块单
    ├── xts_demo                                # XTS测试示例工程
    │   ├── BUILD.gn                                # GN构建脚本
    │   ├── config.json                             # 子系统裁配置裁剪脚本
    │   ├── hals                                    # 产品参数配置
    │   ├── hdf_config                              # HDF硬件描述配置
    │   ├── kernel_configs                          # Kconfig配置输出
    │   └── ohos.build                              # 子系统模块单
    ├── LICENSE                                 # 证书文件
    ├── OAT.xml                                 # 开源仓审查规则配置文件
    ├── README.md                               # 英文版README
    └── README_zh.md                            # 中文版README     

编译工程

进入Linux环境下源码根目录,可以开始编译工程。

  1. 设置工程根目录

    在bash中输入以下命令,可以将当前源码根目录为工程根目录:

    hb set -root .

    此时,会自动进入第二步中的产品选择界面。

    如果hb set命令提示报错,请先执行以下命令去构建并安装ohos-build

    python3 -m pip install --user build/lite
  2. 选择样例产品:

    产品选择界面如下:

    # OHOS Which product do you need? (Use arrow keys)
    
    telink
        >led_demo
         xts_demo
         ble_demo         
         ...

    使用鼠标左击或者方向键,可以选取需要编译的样例产品,按下回车键确定选项。

    也可使用以下命令进行修改:

    hb set -p {PRODUCT_NAME}

    {PRODUCT_NAME}为产品选择界面中列举出来的样例的名称,如xts_demo

  3. 编译

    后续修改了本样例产品中的文件,只需要执行以下命令进行编译,不需要再重复上述第一、二步去设置产品的根目录。

    hb build -f

    生成的固件位于工程根目录下:

    out/{BOARD_NAME}/{PRODUCT_NAME}/bin/{PRODUCT_NAME}.bin

    {BOARD_NAME}为主板名,为b91_devkit

烧录固件

在Windows平台的环境下,烧录固件。

烧录工具

Burning and Debugging Tools(BDT)仅支持在Windows平台下安装和使用,其可执行安装程序为Telink BDT.exe。 点击下载BDT

连接硬件

请按照下面的图示进行硬件连接。图中的紫线表示USB线,其他两根线表示杜邦线。

硬件连接示意图

注意:务必采用默认的跳帽配置。

下图是完成所有硬件连接后状态:

硬件连接实例

烧录

  1. 用USB线连接烧录器到电脑的USB口。

  2. 下载BDT烧录软件,解压到本地文件夹,双击可执行文件"Telink BDT.exe"。 如果一切正常,可以看到如下的窗口显示,在系统标题栏中可以看到已被连接的烧录器的设备信息(见图中红色框)。

    BDT正常启动后的界面

  3. 点击工具栏中的"SWS"按钮,如果看到下图中的消息,则标明所有的硬件连接都没有问题。

    按下SWS按钮后的界面显示

  4. 设置Flash擦除的区域大小。点击工具栏中的"Setting"按钮,在弹出的“Setting"窗口中可以看到默认的Flash擦除的区域大小是512kB。

    默认的Flash擦除的区域大小

    将Flash擦除的区域大小设置为“2040”,如下图所示:

    改写Flash擦除的区域大小

    注意:对于外挂2MB Flash的TLSR9518开发板,Flash最后的8kB空间预留用于保存重要的SoC信息,因此最多可以擦除2040kB的Flash区域。

  5. 点击工具栏中的"Erase"按钮,等待Flash擦除操作完成。

    Flash擦除操作

  6. 选择需要烧录的BIN文件。点击"File"菜单里面的"Open"子菜单,在弹出的文件选择对话框中选中需要烧录的BIN文件。选中后的BIN文件将显示在底部的状态栏中。

    加载BIN文件

  7. 点击工具栏中"Download"按钮,等待Flash烧录完成。

    Flash烧录操作

平台和驱动

烧录工具不需要安装额外的驱动程序。

如果烧录器插入电脑后,可以被Windows的设备管理器正确识别,但是烧录工具软件没有识别到,即在系统标题栏中看不到烧录器的设备信息。

请检查电脑是否用了AMD平台的处理器,如果是的话,请换一台Intel平台处理器的电脑重新尝试。

常见问题

最常见的问题是:在点击工具栏中的"SWS"按钮后,出现下图中的错误信息。

按下SWS按钮后的错误信息

有两种主要原因。

  • 第一种原因是硬件连接不正确。

请参照前面的说明仔细核对所有的硬件连接,确认没有遗漏的连接。

  • 在完全排除硬件连接问题之后,考虑第二种原因,即烧录器的固件版本太低。

请按照下面步骤查看烧录器固件的版本。

  1. 点击Help菜单下的Upgrade子菜单。

  2. 在弹出的Upgrade EVK窗口中,点击"Read FW Version"按钮。在旁边的"Firmware Version"区域将会显示烧录器的固件版本号,例如下图。 如果固件版本号低于V3.4,可以确认是由于固件版本太低导致了通讯错误。请继续下面的步骤去完成固件升级。

    查看烧录器固件版本

  3. 点击窗口中的"Load..."按钮,在BDT工具所在目录下的config目录下的fw子目录找到最新的烧录器固件,如下图中的Firmware_v3.5.bin文件。

    升级烧录器固件

  4. 点击Upgrade按钮完成烧录器固件升级。

  5. 插拔烧录器的USB线,使烧录器重新上电。

提示: 更多BDT的使用说明,请参考Burning and Debugging Tools for all Series

相关仓库

演示样例:vendor_telink

B91开发板:device_board_telink

## End User License Agreement THIS END USER LICENSE AGREEMENT (“AGREEMENT”) IS A LEGAL AGREEMENT BETWEEN YOU (EITHER A SINGLE INDIVIDUAL, OR SINGLE LEGAL ENTITY) AND【 Telink Semiconductor (Shanghai) Co, Ltd 】 (HERE AFTER REFERRED TO AS"【 TELINK 】") FOR THE USE OF THE SOFTWARE ACCOMPANYING THIS AGREEMENT. 【 TELINK 】 IS ONLY WILLING TO LICENSE THE SOFTWARE TO YOU ON CONDITION THAT YOU ACCEPT ALL OF THE TERMS IN THIS AGREEMENT. BY DOWNDOADING OR BY INSTALLING OR OTHERWISE USING OR COPYING THE SOFTWARE YOU INDICATE THAT YOU AGREE TO BE BOUND BY ALL OF THE TERMS OF THIS AGREEMENT. IF YOU DO NOT AGREE TO THE TERMS OF THIS AGREEMENT,【 TELINK 】 WILL NOT LICENSE THE SOFTWARE TO YOU AND YOU MAY NOT INSTALL, USE OR COPY THE SOFTWARE, AND YOU SHALL PROMPTLY DESTROY, DELETE, OR RETURN THE SOFTWARE TO YOUR SUPPLIER. “SOFTWARE” means the software in object code provided under the terms of this Agreement. 【Pudong New Area, Shanghai, People’s Republic of China】 is the signing place of this Agreement. ### 1.GRANT OF LICENSE In consideration of your agreement to abide by the following terms, and subject to the terms and conditions of this Agreement, 【 TELINK 】 hereby grants YOU, a non-transferable, non-exclusive, royalty-free, revocable, worldwide copyright license (without the right to sublicense) to internally use and copy the SOFTWARE to 【usage mode eg.“set up internal development environment with development boards”】 integrating 【 TELINK 】 【chips】, solely for the purpose of【designing, developing or testing your applications】 . All rights to the SOFTWARE and all intellectual property rights contained therein are reserved and shall remain the sole and exclusive property of 【 TELINK 】. The SOFTWARE is licensed but not sold. Except as expressly licensed in Clause 1, in no event shall the license granted in this Clause 1 be construed as granting YOU expressly or by implication, estoppels or otherwise, licenses to any intellectual property rights, including but not limited to patent rights, copyrights, trademark or trade secret in the SOFTWARE. No right is granted to YOU under this Agreement to manufacture, have manufactured, or sell, supply or distribute any products which use or embody any of the SOFTWARE or any of the intellectual property rights embodied therein. ### 2.RESTRICTIONS YOU shall reproduce and not remove or obscure any notice incorporated by 【 TELINK 】 in the SOFTWARE to protect 【 TELINK 】’s intellectual property rights embodied therein. YOU shall not decompile, disassemble, or reverse engineer the SOFTWARE. YOU shall not distribute the SOFTWARE under an open source license as listed by the Open Source Initiative (a non-profit corporation whose website is www.opensource.org), or other license which requires the source code or object code of the SOFTWARE to be licensed or otherwise shared with any third party. ### 3.CONFLICT WITH OPEN SOURCE SOFTWARE LICENSE The SOFTWARE may contain open source software. If the license applied on such open source software has conflict with this Agreement, the license applied on such open source software will prevail and apply to the open source software. ### 4.FEEDBACK YOU may choose to provide suggestions, comments, feedback, ideas, modifications or know-how (whether in oral or written form) relating to the use of the SOFTWARE ("Feedback") to 【 TELINK 】 under the terms of this Agreement. YOU hereby grants to 【 TELINK 】 and its affiliates, under all of you and your affiliates’ (as applicable) intellectual property rights, a perpetual, irrevocable, royalty free, non-exclusive, worldwide license to (i) use, copy and modify the Feedback; (ii) sell, supply, or otherwise distribute the Feedback; (iii) design, have designed, manufacture, have manufactured, use, import, sell, and otherwise distribute and dispose of products that incorporate the Feedback; and (iv) sublicense (together with the rights to further sublicense) the rights granted in this paragraph to any third party. ### 5.NO WARRANTY YOU AGREE THAT THE SOFTWARE IS PROVIDED BY 【 TELINK 】 ON AN "AS IS" BASIS. 【 TELINK 】 MAKES NO WARRANTY, EXPRESSED OR IMPLIED OR STATUTORY, WITH RESPECT TO ANY OF THE SOFTWARE, INCLUDING WITHOUT LIMITATION, ANY IMPLIED WARRANTIES OF MERCHANTABILITY, SATISFACTORY QUALITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT. YOU EXPRESSLY ASSUME ALL LIABILITIES AND RISKS, FOR USE OR OPERATION OF THE SOFTWARE, INCLUDING WITHOUT LIMITATION, SOFTWARE APPLICATIONS DESIGNED OR INTENDED FOR MISSION CRITICAL APPLICATIONS, SUCH AS PACEMAKERS, WEAPONRY, AIRCRAFT NAVIGATION, FACTORY CONTROL SYSTEMS, ETC. SHOULD THE SOFTWARE PROVE DEFECTIVE, YOU ASSUME THE ENTIRE COST OF ALL NECESSARY SERVICING, REPAIR OR CORRECTION. ### 6.NO LIABILITY PLEASE NOTE THAT YOU SHOULD USE THE SOFTWARE AT YOUR OWN RISK. IN NO EVENT SHALL 【 TELINK 】 BE LIABLE FOR ANY DIRECT OR INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL DAMAGES (INCLUDING WITHOUT LIMITATION, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) ARISING IN ANY WAY OUT OF THE USE OF OR INABILITY TO USE THE SOFTWARE, WHETHER UNDER THEORY OF CONTRACT, TORT (INCLUDING NEGLIGENCE), STRICT LIABILITY OR OTHER LEGAL THEORY, EVEN IF 【 TELINK 】 HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. EVEN IF THE SOFTWARE HAS ANY MATERIAL, VERIFIABLE, AND REPRODUCIBLE PROGRAM ERRORS, 【 TELINK 】 SHALL HAVE NO LIABILITY TO MODIFY SUCH ERRORS. NOTWITHSTANDING ANYTHING TO THE CONTRARY CONTAINED IN THIS AGREEMENT, THE MAXIMUM LIABILITY OF 【 TELINK 】 TO YOU IN AGGREGATE FOR ALL CLAIMS MADE AGAINST 【 TELINK 】 IN CONTRACT TORT OR OTHERWISE UNDER OR IN CONNECTION WITH THE SUBJECT MATTER OF THIS AGREEMENT SHALL NOT EXCEED THE TOTAL OF SUMS RECEIVED BY 【 TELINK 】 FROM YOU FOR THIS AGREEMENT. THE EXISTENCE OF MORE THAN ONE CLAIM WILL NOT ENLARGE OR EXTEND THE LIMIT. ### 7.CONFIDENTIALITY YOU acknowledge and agree that the SOFTWARE provided under this Agreement contain trade secrets and confidential material of 【 TELINK 】 and YOU agree to maintain all such information in confidence and apply security measures no less stringent than the measures which YOU apply to protect your own like information, but not less than a reasonable degree of care, to prevent their unauthorized disclosure and use. The period of confidentiality shall be indefinite. YOU agree not to use any such information other than in normal use of the SOFTWARE under the license granted in this Agreement. ### 8.TERM AND TERMINATION This Agreement shall remain in force until terminated. 【 TELINK 】 may terminate this Agreement at any time with or without any cause. Upon termination of this Agreement, YOU shall immediately stop using the SOFTWARE and confidential information and destroy all copies of the SOFTWARE and confidential information in your possession, together with all documentation and related materials. The provisions of clauses 2, 3, 4, 5, 6, 7,8 and 9 shall survive termination of this Agreement. ### 9.GENERAL Any provision of this Agreement which is prohibited or unenforceable in any jurisdiction shall be ineffective to the extent of such prohibition or unenforceability without affecting, impairing or invalidating the remaining provisions hereof. The failure by 【TELINK】 to enforce any of the provisions of this Agreement, unless waived in writing, shall not constitute a waiver of 【TELINK】's rights to enforce such provision or any other provision of this Agreement in the future. This Agreement shall be governed by and construed in accordance with the laws of People’s Republic of China, without reference to the principles of conflicts of laws. Any dispute arising out of or relating to this Agreement shall be submitted to 【 Shanghai Intellectual Property Court 】and the parties waive all objections to that jurisdiction and venue. -------------------------------------------------------------------- Copyright (C) 【2022】【Telink Semiconductor (Shanghai) Co, Ltd 】 All rights reserved.

简介

基于Telink的TLSR9系列SoC,主要存放TLSR9系列芯片的SDK和适配,以及后续其他系列芯片的适配 展开 收起
C 等 3 种语言
Apache-2.0
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