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Telink Semiconductor
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tl_ble_mesh
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V4.2.0.1
712d7fd
2024-11-01 22:01
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Release V4.2.0.1
mwchen
## V4.2.0.1(PR) ### Version * SDK Version: tl_ble_mesh_V4.2.0.1 * Chip Version: - TLSR921X(B91): A2 - TL321X: A1 * Hardware EVK Version: - TLSR921X: C1T213A20_V1.3 - TL321X: C1T331A20_V1.0/C1T335A20_V1.0 * Platform Version: - tl_ble_sdk V4.0.4.2 * Toolchain Version: - TLSR921X: TL32 ELF MCULIB V5F GCC7.4 (IDE: TelinkIoTStudio_V2024.8) - TL321X: TL32 ELF MCULIB V5 GCC12.2 (IDE: TelinkIoTStudio_V2024.8) ### Features * **Supported TL321X A1 chip** - (Firmware)add Flash protection, set APP_FLASH_PROTECTION_ENABLE to 1 to enable, it's enabled by default. - Flash protection is enabled by default, and it must be enabled in production. - During the development phase, user should click the "Unlock" button in Telink BDT tool to unlock before erase/write the Flash. - (Firmware)each mesh nodes can be connected by up to three masters. - (Firmware)add TL321X_mesh_LPN with suspend/deepsleep_retention mode. - (Firmware)add TL321X_mesh_switch with suspend/deepsleep_retention mode. * **Android/iOS** - add support to modify cloud URL. - optimize fast provision function, add logs during fast provisioning. - add support App to connect specified node. ### Bug Fixes * fix the following issue by moving proxy filter initial function from connection callback to disconnection callback: When both Phone A and Phone B connecting with node C, if Phone A disconnects and connects to node D, Phone A will fails to get the status of node C. ### Known issues * TL321X_mesh_gw do not support USB mode currently, use uart mode by default. ### Performance Improvements * N/A ### BREAKING CHANGES * N/A ### Notes * debugging tools: such as sig_mesh_tool.exe and Android apk, please make sure to use the tools of this release. * to avoid compilation errors or loss of functionality, please update all files when upgrading the SDK. * for the release note contents of the BLE SDK and Driver SDK mentioned in "Version", please refer to the release note files of related SDKs. * support SIG Mesh single connection app TelinkBleMesh. ### Flash * TLSR921X - P25Q80U - P25Q16SU - P25Q32SU * TL321X - P25Q80U - P25Q16SU ### CodeSize * TLSR921X - B91_mesh(default target) - Flash bin size: 156.0KB - IRAM size: 58.9KB - DRAM size: 4KB stack - B91_mesh_gw(default target) - Flash bin size: 155.2KB - IRAM size: 63.2KB - DRAM size: 4KB stack - B91_mesh_lpn(default target) - Flash bin size: 150.4KB - IRAM size: 52.5KB - DRAM size: 4KB stack - B91_mesh_switch(default target) - Flash bin size: 142.4KB - IRAM size: 53.5KB - DRAM size: 4KB stack * TL321X - TL321X_mesh(default target) - Flash bin size: 161.5KB - IRAM size: 60.4KB - DRAM size: 4KB stack - TL321X_mesh_gw(default target) - Flash bin size: 161.0KB - IRAM size: 65.2KB - DRAM size: 4KB stack - TL321X_mesh_lpn(default target) - Flash bin size: 155.2KB - IRAM size: 54.3KB - DRAM size: 4KB stack - TL321X_mesh_switch(default target) - Flash bin size: 145.6KB - IRAM size: 54.3KB - DRAM size: 4KB stack ### Version * SDK Version: tl_ble_mesh_V4.2.0.1 * Chip Version: - TLSR921X(B91): A2 - TL321X: A1 * Hardware EVK Version: - TLSR921X: C1T213A20_V1.3 - TL321X: C1T331A20_V1.0/C1T335A20_V1.0 * Platform Version: - tl_ble_sdk V4.0.4.2 * Toolchain Version: - TLSR921X: TL32 ELF MCULIB V5F GCC7.4 (IDE: TelinkIoTStudio_V2024.8) - TL321X: TL32 ELF MCULIB V5 GCC12.2 (IDE: TelinkIoTStudio_V2024.8) ### Features * **支持 TL321X A1 芯片** - (Firmware)添加Flash保护,设置 APP_FLASH_PROTECTION_ENABLE 等于 1来使能该功能,默认打开。 - SDK 中默认开启 Flash 保护,在量产时必须启用。 - 在开发阶段,用户在擦写Flash前应使用Telink BDT工具中的“Unlock”命令解锁Flash。 - (Firmware)每个mesh节点支持最多3个master同时连接。 - (Firmware)添加TL321X_mesh_LPN,具备suspend/deepsleep_retention休眠模式。 - (Firmware)添加TL321X_mesh_switch,具备suspend/deepsleep_retention休眠模式。 * **Android/iOS** - 支持可编辑云端地址。 - 优化fast provision功能, UI上添加更多provision过程信息显示。 - 支持App连接指定的节点。 ### Bug Fixes * 将代理列表初始化从连接回调中移到断开连接回调修复以下问题: 当手机A和手机B同时连接到节点C时,如果手机A断开连接并连接到节点D,手机A将无法获取节点C的状态。 ### Known issues * TL321X_mesh_gw 暂不支持usb模式,默认使用串口模式。 ### Performance Improvements * N/A ### BREAKING CHANGES * N/A ### Notes * 调试工具:比如sig_mesh_tool.exe和APP 安装包文件,请务必使用本次release的版本。 * 为避免编译错误以及功能丢失,升级SDK时,请确认更新全部SDK文件。 * “Version”里面提到的BLE SDK和Driver SDK的release note内容,请查阅对应SDK的release note文件。 * 支持SIG Mesh单连接app TelinkBleMesh。 ### Flash * TLSR921X - P25Q80U - P25Q16SU - P25Q32SU * TL321X - P25Q80U - P25Q16SU ### CodeSize * TLSR921X - B91_mesh(default target) - Flash bin size: 156.0KB - IRAM size: 58.9KB - DRAM size: 4KB stack - B91_mesh_gw(default target) - Flash bin size: 155.2KB - IRAM size: 63.2KB - DRAM size: 4KB stack - B91_mesh_lpn(default target) - Flash bin size: 150.4KB - IRAM size: 52.5KB - DRAM size: 4KB stack - B91_mesh_switch(default target) - Flash bin size: 142.4KB - IRAM size: 53.5KB - DRAM size: 4KB stack * TL321X - TL321X_mesh(default target) - Flash bin size: 161.5KB - IRAM size: 60.4KB - DRAM size: 4KB stack - TL321X_mesh_gw(default target) - Flash bin size: 161.0KB - IRAM size: 65.2KB - DRAM size: 4KB stack - TL321X_mesh_lpn(default target) - Flash bin size: 155.2KB - IRAM size: 54.3KB - DRAM size: 4KB stack - TL321X_mesh_switch(default target) - Flash bin size: 145.6KB - IRAM size: 54.3KB - DRAM size: 4KB stack
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